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Weight is security market value divided by fund net assets.","Residual is 100% minus disclosed equity weights. It combines cash, non-equity investments, derivatives, other assets and liabilities; it is not a pure cash holding.","Sector labels join disclosed issuer names to the June 30, 2026 VTI shareholder-report schedule. This is an issuer-defined classification scheme, not GICS. Unmatched issuers remain Unclassified.","Dates differ among funds. Results compare dated snapshots rather than simultaneous live portfolios.","Company grouping uses curated major-company aliases, then issuer LEI (including a unique exact-name LEI disclosed by another fund), then normalized issuer name. 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The source describes products and shipping status, without disclosing a bilateral contract value.","announcementDate":"2025-03-18","status":"Products shipping; platform collaboration reported","verifiedAt":"2026-10-18","sourceUrl":"https://investors.micron.com/news/press-release/2025/Micron-Innovates-From-the-Data-Center-to-the-Edge-With-NVIDIA-03-18-2025/default.aspx","amount":null},{"id":"oracle-openai-stargate-2025","from":"oracle","to":"openai","fromName":"Oracle","toName":"OpenAI","type":"cloud","title":"Stargate capacity agreement","description":"Oracle and OpenAI agreed to develop 4.5 GW of additional U.S. data-center capacity. The same announcement reported initial GB200 racks and early workloads at Abilene. Additional planned capacity should not be read as fully operational capacity.","announcementDate":"2025-07-22","status":"Expansion agreement; some initial infrastructure operating","verifiedAt":"2026-10-18","sourceUrl":"https://openai.com/index/stargate-advances-with-partnership-with-oracle/","amount":null},{"id":"asml-tsmc-lithography-2026","from":"asml","to":"tsmc","fromName":"ASML","toName":"Taiwan Semiconductor Manufacturing","type":"supplier","title":"Lithography collaboration","description":"ASML and TSMC announced a 12-inch photomask initiative, targeting a pilot line by 2031 and system readiness by 2033. TSMC said it intends to use ASML High NA technology in high-volume manufacturing from 2030. These are future targets, not completed tool deliveries.","announcementDate":"2026-09-08","status":"Initiative announced; future production targets","verifiedAt":"2026-10-18","sourceUrl":"https://www.investor.asml.com/news-releases/news-release-details/asml-and-tsmc-announce-initiative-pioneer-industry-transition-large-format-photomasks-high-na-euv","amount":null}]}